Previous REU student Nathan Song made his way to Boston this summer to present his work at the IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS). Although the weather cancelled flights across the coast, Nathan made it. He presented a new way to connect up microdevices using flexible microgrippers to clip onto wires and deliver current. This method has the potential to bond many wires at once. The conference paper is here:
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Song, Nathan, Danming Wei, and Cindy K Harnett. 2023. “Powering Wire-Mesh Circuits through MEMS Fiber-Grippers.” In
2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) , 1–4.
https://doi.org/10.1109/FLEPS57599.2023.10220225 .